|Title:||Advanced interconnects for ULSI technology|
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:
Interconnect functions, characterisations, electrical properties and wiring requirements
Low-k materials: fundamentals, advances and mechanical properties
Conductive layers and barriers. [As taken from amazon.com]