New title for Electrical and Electronic Engineering

Title:   Advanced interconnects for ULSI technology
Author:   Baklanov, Mikhail.
Call number:   TK7874.53.A244
Availability:  Click here

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:
Interconnect functions, characterisations, electrical properties and wiring requirements
Low-k materials: fundamentals, advances and mechanical properties
Conductive layers and barriers. [As taken from]

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